出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.proeng.2011.04.405
关键词
Porous materials; thermal shock fracture; finite element method
In this study, four different porous microstructures were modelled and simulated using a random algorithm and a three-dimensional finite element method. The effect of pore morphology on the elastic modulus and thermal conductivity of the porous ceramic was investigated, and their possible roles in determination of thermal shock induced stress were studied using the results of finite element simulations. Finally, the relationships between the porous microstructure and their thermal shock cracking resistance were discussed, in terms of pore shape and pore morphology. (C) 2011 Published by Elsevier Ltd. Selection and peer-review under responsibility of ICM11
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