期刊
MICROMACHINES
卷 9, 期 6, 页码 -出版社
MDPI
DOI: 10.3390/mi9060287
关键词
microfluidics; 3D; integrated circuits; cooling
类别
资金
- Science and Technology Development Program of Shaanxi [2016GY-091]
- Natural Science Foundation of Shenzhen [JCYJ2016042915311 908]
Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (ICs) is recognized as a promising method of extending Moore law progression in electronic components and systems. Since the U.S. Defense Advanced Research Projects Agency launched Intra/Inter Chip Enhanced Cooling thermal packaging program, the method of using microfluidic cooling in 3D ICs has been under continuous development. This paper presents an analysis of all publications available about the microfluidic cooling technologies used in 3D IC thermal management, and summarized these research works into six categories: cooling structure design, co-design issues, through silicon via (TSV) influence, specific chip applications, thermal models, and non-uniform heating and hotspots. The details of these research works are given, future works are suggested.
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