期刊
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY
卷 8, 期 2, 页码 201-208出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TTHZ.2017.2788202
关键词
Adhesive bonding; high-resistivity silicon (HR-Si); terahertz (THz) dielectric waveguide
资金
- Natural Sciences and Engineering Research Council of Canada
- C-COM Satellite Systems Inc.
A silicon-BCB-quartz (SBQ) terahertz (THz) dielectric waveguide is proposed, investigated, fabricated, and verified experimentally. In this structure, silicon and quartz are bonded using a thin adhesive layer, benzocyclobutene (BCB). The fabrication process of this new waveguide, which is very simple and can be performed using basic clean room facilities, is presented. To demonstrate the performance of the proposed waveguide structure, a number of samples are designed, fabricated, and measured for the 500-580 GHz frequency range. Using the proposed structure, a THz waveguide with losses as low as 0.026 dB/lambda(0) is achieved for the mentioned frequency range. Moreover, an SBQ bend is designed, fabricated, and the measurement results are presented. The proposed structure is low loss, efficient, easy-to-fabricate, and presents a platform for numerous dielectric-based THz passive and active devices.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据