4.5 Article

Effect of Cold Atmospheric Pressure Plasma on Maize Seeds: Enhancement of Seedlings Growth and Surface Microorganisms Inactivation

期刊

PLASMA CHEMISTRY AND PLASMA PROCESSING
卷 38, 期 5, 页码 969-988

出版社

SPRINGER
DOI: 10.1007/s11090-018-9913-3

关键词

Cold atmospheric pressure plasma; Maize seed; Inactivation; Filamentous fungi; Germination enhancement

资金

  1. Slovak Research and Development Agency [APVV-16-0216]

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Cold atmospheric pressure ambient air plasma generated by Diffuse Coplanar Surface Barrier Discharge (DCSBD) was investigated for inhibition of native microbiota and potentially dangerous pathogens (Aspergillus flavus, Alternaria alternata and Fusarium culmorum) on the maize surface. Moreover, the improvement of germination and growth parameters of maize seeds was evaluated. Maize (Zea mays L.; cv. Ronaldinio), one of the most important cultivated crops worldwide, was selected as the research material. Electrical measurements confirmed the high volume power density (80 W cm(-3)) of DCSBD plasma. Non-equilibrium plasma state evaluated using optical emission spectroscopy showed values of vibrational and rotational temperature (2700 +/- 300) K and (370 +/- 75) K, respectively. Changes on the plasma treated seeds surface were studied by water contact angle measurement, scanning electron microscope analysis and Fourier transform infrared spectroscopy. A complete devitalisation of native microbiota on the surface of seeds was observed after a short treatment time of 60 s (bacteria) and 180 s (filamentous fungi). The plasma treatment efficiency of artificially contaminated maize seeds was estimated as a reduction of 3.79 log (CFU/g) in F. culmorum after a 60-s plasma treatment, 4.21 log (CFU/g) in A. flavus and 3.22 log (CFU/g) in A. alternata after a 300-s plasma treatment. Moreover, the obtained results show an increase in wettability, resulting in a better water uptake and in an enhancement of growth parameters. The investigated DCSBD plasma source provides significant technical advantages and application potential for seed surface finishing without the use of hazardous chemicals.

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