期刊
MICROELECTRONICS RELIABILITY
卷 83, 期 -, 页码 198-205出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2018.02.013
关键词
Electronic packaging; Zinc; Tin; Finite element method; SEM; Nemst-Planck equation
资金
- China Postdoctoral Science Foundation [2017M611215]
- Research Fund for International Young Scientists of the National Natural Science Foundation of China (NSFC) [51750110504]
- National Natural Science Foundation of China [51571049, 51675080]
In microelectronic circuit exposed to humid environment, the growth phenomenon of dendritic deposits due to the electrochemical migration (ECM) of metallic ions, generates a serious reliability issue. ECM of Sn and Zn ions in deionized water with Sn-9Zn electrodes, has been in-situ studied at gap potentials of 3 and 5 V. At 3 V, tin ions (with 15.61 wt%) dominate the composition of metallic dendrites whereas Zn ions (with 20.99 wt%) show greater presence in the experiment with 5 V. The Nemst-Planck transport equation has been solved using finite element method in order to describe the kinetics of ECM of Sn2+ and Zn2+ ions. The composition of resultant dendrites is governed by the competition between advection rate, transport time scale and anodic surface concentration of metallic species.
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