期刊
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
卷 78, 期 -, 页码 13-21出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.mssp.2017.10.021
关键词
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This study resumes the status of our knowledge about the formation of extended and intrinsic defects in ion implanted 4H-SiC homo-epitaxial wafers during a high temperature post-implantation annealing in presence of homogeneous heating of the ion implanted wafer. A particular attention is given to the implanted dopant concentrations of interest for the fabrication of 4H-SiC electronic devices. The issue to preserve a high electrical activation and at the same time to avoid the formation of defects and/or to reduce those that have been formed is discussed. The case of the Al+ ion implanted 4H-SiC is used as example and original results are presented.
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