期刊
出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2018.03.014
关键词
Direct metal laser sintering (DMIS); Transmission electron microscopy (TEM); Electron bacicscattering diffraction (EBSD); Dynamic recovery (DRV); Dynamic recrystallization (DRX)
类别
资金
- Natural Sciences and Engineering Research Council of Canada (NSERC) [RGPIN-2016-04221]
- New Brunswick Innovation Foundation [(NBIF)-RIF2017-071]
A DMLS-AlSi10Mg_200C was subjected to dynamic loading at two strain rates. At 1680 s(-1), an ultrafine substructure formed inside the alpha-Al dendrites due to dynamic recovery (DRV). At 4300 s(-1), continuous dynamic recrystallization (CDRX) occurred, followed by DRV inside the DRX grains with development of nanoscale subgrains.
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