期刊
MATERIALS CHEMISTRY AND PHYSICS
卷 207, 期 -, 页码 303-308出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.matchemphys.2017.12.079
关键词
Electroless plating; Ionic liquid; Aluminum plating; Aluminum plated nickel
资金
- United Technologies Research Center
- FEI Company under an FEI-UConn partnership agreement
- National Institute of Standards and Technology, U.S. Department of Commerce
Electroless deposition of aluminum using room temperature ionic liquids (RTIL) and liquid reducing agents is extremely water sensitive and has only been successful in glove boxes with deposition on copper or glass substrates. We have successfully brought the deposition out of the glove box using Schlenk techniques. We also have reported the first electroless aluminum deposition onto a nickel nanowire substrate. The nanowire synthesis and subsequent aluminum deposition were confirmed with measurements of X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDS), Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), small angle neutron scattering (SANS), and a superconducting quantum interference device (SQUID) magnetometer. Aluminum plating reached a deposition rate of 1.14 x 10(-4) mol/hr. Results indicate a smooth and pure aluminum coating with thin surface oxidation on the nanowires. (C) 2017 Elsevier B.V. All rights reserved.
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