Simulation of thermal shock cracking in ceramics using bond-based peridynamics and FEM

The effects of moderate intensity 'hot' or 'cold' shock in brittle solids have been extensively studied, while much less is known about thermal shock response during large temperature variations. In this study, a combined finite element - peridynamics numerical procedure is proposed for the simulation of cracking in ceramic materials, undergoing severe thermal shock. Initially, Finite Element nonlinear heat transfer analysis is conducted. The effects of surface convection and radiation heat exchange are also included. Subsequently, the interpolated temperature field is used to formulate a varying temperature induced action for a bond-based peridynamics model. The present model, which is weakly coupled, is found to reproduce accurately previous numerical and experimental results regarding the case of a 'cold' shock. Through several numerical experiments it is established that 'cold' and 'hot' shock conditions give rise to different failure modes and that large temperature variations lead to intensified damage evolution.