期刊
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 27, 期 1, 页码 28-30出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2017.2772310
关键词
Ion-trap chip; microfabrication; sacrificial process
类别
资金
- Ministry of Science, Information and Communication Technologies (ICT)
- Future Planning, South Korea through Information Technology Research Center [IITP-2017-2015-0-00385]
- ICT Research and Development Program [10043464]
Accumulated electrostatic charges on the dielectric surfaces of ion traps are known to induce stray fields, leading to ion micromotions. In typical microfabricated ion-trap chips, metal electrodes are electrically isolated using thick dielectric pillars, which can accumulate stray charges on their sidewalls. This letter presents a new microfabrication method for ion-trap chips that reduces the exposure of dielectric surfaces to trapped ions. The dielectric pillars are fabricated with large T-shaped overhangs, and the sidewalls and top surfaces are coated with AlCu (1%) films. The bottom sides of the overhang parts provide electrical isolation. To prevent oxidation of the AlCu (1%) films, the electrode surfaces are coated with an additional Au film. The fabricated chips were implemented to trap Yb-174(+) ions, and the laser-induced stray fields were measured. The results indicated that the trap chip fabricated by the newly developed method generates significantly smaller stray fields as compared with previous chips. [2017-0233]
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