Control of Mg2Sn formation through ultrasonic-assisted transient liquid phase bonding of Mg to Al

The formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17 was successfully avoided through ultrasonic assisted transient liquid phase bonding Mg/Al using pure Sn interlayers. A new IMC of Mg2Sn formed in the joints. Different bonding parameters were used to control the formation of Mg2Sn. The optimum joint shear strength of 60.0 MPa was obtained at the temperature of 220 degrees C, ultrasonic power of Mode I and ultrasonic time of 4 s. The thickness of Mg2Sn should be depressed to less than 15% of the joint width. Joints were fractured through the Mg2Sn layer.