A room temperature cured low dielectric hyperbranched epoxy adhesive with high mechanical strength

A low dielectric constant hyperbranched epoxy thermoset with excellent adhesive and mechanical strength is the demand for advanced electronics and engineering applications. The present investigation provided a room temperature, curable hyperbranched epoxy, obtained by an A(2) + B-3 polycondensation reaction. The synthesized hyperbranched epoxy was cured by a combined hardener system consisting of a commercial poly(amido-amine) and a first generation aliphatic poly(amido-amine) dendrimer (PAD) prepared by Michael addition reaction of methyl acrylate and aliphatic amines. The thermoset exhibited high mechanical strength, excellent adhesive strength, low dielectric constant, good thermal stability and excellent weather resistance along with very good moisture resistance. The results showed the influence of the amount of PAD on the performance of the thermoset. Thus, the study revealed that the combined poly(amido-amine) cured hyperbranched epoxy has high potential in advanced electrical packaging and microelectronic devices.