期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 764, 期 -, 页码 51-61出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2018.06.042
关键词
Coupling electric pulse and ultrasonics; Severe plastic deformation; Grain boundaries; Gradient nanostructure layer; Transmission electron microscopy
资金
- National Natural Science Foundation of China [51675535]
- China Postdoctoral Science Foundation [2015M570619]
- Key Pre-Research Foundation of Military Equipment of China [6140923030702]
- Fundamental Research Funds for Central Universities [15CX08007A, 17CX02058]
Severe plastic deformation can be easily produced on metal surfaces by coupling the micro thermal shock from high peak pulse current and the micro mechanical shock from ultrasonics. Moreover, an efficient method for preparing a gradient nanostructured metal surface by coupling electric pulse and ultrasonics treatment (CEPUT) is developed in this study. The variation in microstructure and hardness of the specimen are investigated by electron backscatter diffraction, transmission electron microscope, X-ray diffraction, and nano-indentation measurement. Results showed that on the treated copper surface with CEPUT, the original grain boundaries are no longer recognized, the average grain size decreases from 48.77 mu m to 39.22 nm, and the thickness of severe plastic deformation layer reaches to approximately 500 mu m. Moreover, the hardness reaches to 2.105 GPa, and CEPUT also reduces the texture in the sample surface. A computational model is developed and the grain refinement mechanism is proposed to describe the electrical-thermal-mechanical phenomena during CEPUT. The proposed simple and cost-effective method of grain refinement and to produce the graded materials is effective, especially in the materials of high thermal and electrical conductivity. (C) 2018 Elsevier B.V. All rights reserved.
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