期刊
MODERN TECHNOLOGIES IN MATERIALS, MECHANICS AND INTELLIGENT SYSTEMS
卷 1049, 期 -, 页码 762-766出版社
TRANS TECH PUBLICATIONS LTD
DOI: 10.4028/www.scientific.net/AMR.1049-1050.762
关键词
wafer; feature size; DPW
the paper introduced the bare silicon crystal how to become a wafer. then, it told the processing of wafers to produce integrated circuits. Today, most integrated circuits (ICs) are made of silicon. every integrated circuit is tested and functional and formed a dies. At last, the article explain feature size and the number of gross die per wafer (DPW).
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