期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 33, 期 5, 页码 3898-3910出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2017.2723948
关键词
AC-DC power conversion; active filters; capacitive energy storage; HVDC transmission; power system faults; power transmission protection
资金
- U.K. Power Electronic Centre: Converter Theme (ESPRC Grant) [EP/K035096/1]
- U.K. Power Electronic Centre: HubNet Consortium (EPSRC Grant) [EP/I013636/1]
- U.K. Power Electronic Centre: RESTORES (EPSRC Grant) [EP/L014351/1]
- EDF Energy RD U.K.
- GE's Grid Solutions
- Engineering and Physical Sciences Research Council [EP/L014351/1, EP/J021199/1, 1401185, EP/I013636/1, EP/K035096/1] Funding Source: researchfish
- EPSRC [EP/J021199/1, EP/I013636/1, EP/K035096/1, EP/L014351/1] Funding Source: UKRI
The alternate arm converter (AAC) was one of the first modular converter topologies to feature dc-side fault ride-through capability with only a small penalty in power efficiency. However, the simple alternation of its arm conduction periods (with an additional short overlap period) resulted in 1) substantial six-pulse ripples in the dc current waveform, 2) large dc-side filter requirements, and 3) limited operating area close to an energy sweet spot. This paper presents a new mode of operation called extended overlap (EO) based on the extension of the overlap period to 60 degrees, which facilitates a fundamental redefinition of the working principles of the AAC. The EO-AAC has its dc current path decoupled from the ac current paths, a fact allowing 1) smooth dc current waveforms, 2) elimination of dc filters, and 3) restriction lifting on the feasible operating point. Analysis of this new mode and EO-AAC design criteria are presented and subsequently verified with tests on an experimental prototype. Finally, a comparison with other modular converters demonstrates that the EO-AAC is at least as power efficient as a hybrid modular multilevel converter (MMC) (i.e., a dc fault ride-through-capable MMC), while offering a smaller converter footprint because of a reduced requirement for energy storage in the submodules and a reduced inductor volume.
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