4.6 Article Proceedings Paper

Spatial Electro-Thermal Modeling and Simulation of Power Electronic Modules

期刊

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
卷 54, 期 1, 页码 404-415

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIA.2017.2757898

关键词

Insulated-gate bipolar transistor (IGBT) loss modeling; model reduction techniques; power modules; thermal modeling

资金

  1. German Federal Ministry of Education and Research (BMBF) [16EMO0023]

向作者/读者索取更多资源

In this work, the spatial electro-thermal modeling and simulation of power electronic modules is discussed. It is shown how physical and mathematical modeling techniques can be combined to obtain a compact time-efficient electro-thermal simulation framework for power electronic modules. The accuracy of the modeling framework is demonstrated based on experiments. It can be used for the fast calculation of the temperature distribution of a power module in an electric vehicle over driving cycles. The spatial temperature information allows to effectively estimate the lifetime of the power module.

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