期刊
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
卷 54, 期 4, 页码 3453-3462出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIA.2018.2812710
关键词
Junction temperature monitoring; on-state resistance; on-state voltage; silicon carbide (SiC) power MOSFET; thermo-sensitive electrical parameters (TSEP)
This paper dealswith real-time estimation of the junction temperature of SiC power MOSFETs. The junction temperature of a device with four-switch module is estimated in real-time by measuring its current and on-state voltage VON at each switching period and entering the temperature in the lookup table of the device. The temperature model is preliminarily obtained in a dedicated commissioning session, where VON is measured at different temperature and current conditions. The results show the feasibility of online temperature monitoring and even the active limitation of the junction temperature of the tested SiC power MOSFET modules accurately and with an instantaneous dynamic response. Different modules with die from different manufacturers were tested in an H-bridge demonstrator power converter, emulating the operating conditions of real converters such as voltage source dc/ac or dc/dc conversion structures. The commissioning procedure is meant to be performed directly on the final application for each converter. The measurements obtained using the proposed temperature estimation technique are validated using a thermal camera and compared to the direct measurement of the die temperature with a thermistor, showing high accuracy and high feasibility.
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