期刊
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS
卷 14, 期 12, 页码 5594-5600出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TII.2018.2817520
关键词
Active thermography; data analysis; non-destructive testing (NDT); sparse principal component analysis (SPCA); thermographic analysis
类别
资金
- Ministry of Science and Technology, R.O.C. [MOST 105-2628-E-007-013-MY2]
Active thermography is an efficient and powerful technique for nondestructive testing of products made of composite materials, which enables rapid inspection of large areas, presents results as easily interpreted high-resolution images, and is easy to operate. In recent years, a number of thermographic data analysis methods were developed to enhance the visibility of subsurface defects, among which principal component thermography (PCT) is recommended because of its capability to enhance the contrast between defective and defect-free areas, compress data, and reduce noise. In this study, a sparse principal component thermography (SPCT) method is proposed, which inherits the advantages of PCT and allows more flexibility by introducing a penalization term. Compared to PCT, SPCT provides more interpretable analysis results owing to its structure sparsity. The feasibility and effectiveness of the proposed method are illustrated by the experimental results of the subsurface defect characterization in a carbon fiber reinforced plastic specimen.
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