4.6 Article

Ohmic Contact-Free Mobility Measurement in Ultra-Wide Bandgap AlGaN/AlGaN Devices

期刊

IEEE ELECTRON DEVICE LETTERS
卷 39, 期 1, 页码 55-58

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2017.2771148

关键词

AlGaN; mobility; ohmic contact; Schottky

资金

  1. AWE Technical Outreach Fund
  2. Sandia National Laboratories Ultra-Wide Bandgap Power Electronics Grand Challenge LDRD
  3. Engineering and Physical Sciences Research Council [EP/L007010/1]
  4. U.S. Department of Energy's National Nuclear Security Administration [DE-NA-0003525]
  5. EPSRC [EP/N031563/1] Funding Source: UKRI
  6. Engineering and Physical Sciences Research Council [1629782, EP/N031563/1, 1881432, 1515447] Funding Source: researchfish

向作者/读者索取更多资源

We measure the electron density dependence of carrier mobility in ultra-wide bandgap Al0.85Ga0.15N/Al0.7Ga0.3N heterostructures, using only Au/Pt Schottky contact deposition and without the need for Ohmic contacts. With this technique, we measure mobility over a two-dimensional electron gas density range from 10(10) to 10(13) cm(-2) at an AlGaN/AlGaN heterojunction. At room temperature, subthresholdmobility was 4 cm(2)/Vs and peakmobility 155 cm(2)/Vs. Peak mobility decreased with temperature as T-0.86 suggesting alloy scattering as the dominant scattering mechanism.

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