4.7 Article

Support-free hollowing for 3D printing via Voronoi diagram of ellipses

期刊

COMPUTER-AIDED DESIGN
卷 101, 期 -, 页码 23-36

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.cad.2018.03.007

关键词

Additive manufacturing; Ellipse packing; Voronoi diagram of polygon; Voronoi diagram of disks; Printing overhang; Voronoi diagram machine

资金

  1. National Research Foundation of Korea (NRF) - Korea government (MSIP, MSIT) [2017R1A3B1023591, 2016K1A4A3914691]
  2. National Research Foundation of Korea [2016K1A4A3914691, 2017R1A3B1023591] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

向作者/读者索取更多资源

3D printing, also called additive manufacturing, has been increasingly popular and printing efficiency has become more critical. To print artifacts faster with less material, thus leading to lighter and cheaper printed products, various types of void structures have been designed and engineered inside of shape models. In this paper, we present a novel method for generating support-free elliptic hollowing for 3D shapes which can entirely avoid additional supporting structures. To achieve this, we perform the ellipse hollowing in one of the cross sectional polygons and then extrude the hollowed ellipses to the other parallel cross sections. To efficiently pack the ellipses in the polygon, we construct the Voronoi diagram of ellipses to reason the free-space around the ellipses and other geometric features by taking advantage of the available algorithm for the efficient and robust construction of the Voronoi diagram of circles. We demonstrate the effectiveness and feasibility of our proposed method by designing and printing support-free hollow for various 3D shapes using Poretron, the program which computes the hollow by embedding appropriate APIs of the Voronoi Diagram Machine library that is freely available from Voronoi Diagram Research Center. It takes a 3D mesh model and produces an STL file which can be either fed into a 3D printer or postprocessed. (C) 2018 The Author(s). Published by Elsevier Ltd.

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