期刊
CARBON
卷 133, 期 -, 页码 275-282出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2018.03.032
关键词
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资金
- Ministry of Science and Technology of China [2016YFA0200101]
- National Natural Science Foundation of China [51625203, 51532008, 51521091, 51572264, 51772303]
- Chinese Academy of Sciences [174321KYSB20160011, KGZD-EW-T06]
- CAS/SAFEA International Partnership Program for Creative Research Teams
- MOPPI project of the Aalto University AEF Research Program
- Liaoning BaiQianWan Talents Program
The difficulty of transferring vertically-aligned carbon nanotube (VACNT) arrays onto specific substrates limits their use in many fields, for instance as thermal interface materials or electrical interconnects in microelectronics. Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays. Here, we report a simple and clean press transfer method that does not use transfer media, and involves only pressing and lifting steps. This method enables not only the transfer of patterned and very thin VACNT arrays but also the tight adhesion of the arrays onto various flat or curved target substrates. Flexible and transparent electrodes were fabricated by transferring inter-digitated VACNT patterns onto a PET substrate. VACNT arrays with a thickness of 20 mu m were transferred onto target substrates cleanly, showing a very low thermal resistance of similar to 26 K mm(2) W-1. The transferred clean, thin VACNT arrays show good heat dissipation as thermal interface material when integrated into a desktop computer CPU cooling system. (C) 2018 Elsevier Ltd. All rights reserved.
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