期刊
APPLIED THERMAL ENGINEERING
卷 129, 期 -, 页码 1010-1025出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2017.10.098
关键词
High power electronics; Thermal management; Electronics cooling; Liquid cooling; Thermal contact heat exchanger
资金
- Natural Sciences and Engineering Research Council of Canada (NSERC)
- Canada Foundation for Innovation (CFI)
- Raytheon Canada
This paper presents the outcomes of a research project aimed at designing and experimentally evaluating a thermal contact liquid cooling system for military applications. The proposed system replaces fluidic connectors found in conventional water cooling systems with a thermal contact heat exchanger. This approach enhances reliability by eliminating leakage risks; however, it also undermines thermal performance by adding thermally resistive heat transfer interfaces. Experiments were conducted to quantify the downgraded thermal performance and to establish whether it is a viable trade-off for enhanced reliability. An experimental setup was constructed in order to simulate heat generation by a single processor. Results showed that the proposed system requires inlet water as warm as 53.2 degrees C at a maximum heat load of 300W. For comparison, it was also shown that the proposed thermal contact water cooling system would require 43% more energy than a conventional water cooling system if operating at ambient temperatures sufficiently higher than 50 degrees C. (C) 2017 Elsevier Ltd. All rights reserved.
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