期刊
ADVANCED MATERIALS
卷 30, 期 11, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201704955
关键词
3D integration; biodegradable electronics; flexible devices; heterogeneous integration; transfer printing
类别
资金
- University of Illinois
- National Taiwan University
- Office of China Postdoctoral Council
- Center for Bio-Integrated Electronics at Northwestern University
Biodegradable electronic systems represent an emerging class of technology with unique application possibilities, from temporary biomedical implants to green consumer gadgets. This paper introduces materials and processing methods for 3D, heterogeneously integrated devices of this type, with various functional examples in sophisticated forms of silicon-based electronics. Specifically, techniques for performing multilayer assembly by transfer printing and for fabricating layer-to-layer vias and interconnects by lithographic procedures serve as routes to biodegradable, 3D integrated circuits composed of functional building blocks formed using specialized approaches or sourced from commercial semiconductor foundries. Demonstration examples range from logic gates and analog circuits that undergo functional transformation by transience to systems that integrate multilayer resistive sensors for in situ, continuous electrical monitoring of the processes of transience. The results significantly expand the scope of engineering options for biodegradable electronics and other types of transient microsystem technologies.
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