4.7 Article

A Comprehensive Comparison of the Analytical and Numerical Prediction of the Thermal History and Solidification Microstructure of Inconel 718 Products Made by Laser Powder-Bed Fusion

期刊

ENGINEERING
卷 3, 期 5, 页码 685-694

出版社

ELSEVIER
DOI: 10.1016/J.ENG.2017.05.023

关键词

Additive manufacturing; Finite-element modeling; Rosenthal equation; Microstructure; Thermal behavior; Inconel 718

资金

  1. Royal Thai Government
  2. Bertucci Graduate Fellowship
  3. Early Stage Innovations under National Aeronautics and Space Administration (NASA)'s Space Technology Research Grants Program [NNX 17AD03G]

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The finite-element (FE) model and the Rosenthal equation are used to study the thermal and microstructural phenomena in the laser powder-bed fusion of Inconel 718. A primary aim is to comprehend the advantages and disadvantages of the Rosenthal equation (which provides an analytical alternative to FE analysis), and to investigate the influence of underlying assumptions on estimated results. Various physical characteristics are compared among the FE model, Rosenthal equation, and experiments. The predicted melt pool shapes compared with reported experimental results from the literature show that both the FE model and the analytical (Rosenthal) equation provide a reasonably accurate estimation. At high heat input, under conditions leading to keyholing, the reported melt width is narrower than predicted by the analytical equation. Moreover, a sensitivity analysis based on choices of the absorptivity is performed, which shows that the Rosenthal approach is more sensitive to absorptivity, compared with the FE approach. The primary reason could be the effect of radiative and convective losses, which are assumed to be negligible in the Rosenthal equation. In addition, both methods predict a columnar solidification microstructure, which agrees well with experimental reports, and the primary dendrite arm spacing (PDAS) predicted with the two approaches is comparable with measurements. (C) 2017 THE AUTHORS. Published by Elsevier LTD on behalf of the Chinese Academy of Engineering and Higher Education Press Limited Company.

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