4.6 Article

Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

期刊

CRYSTALS
卷 8, 期 1, 页码 -

出版社

MDPI AG
DOI: 10.3390/cryst8010009

关键词

nanoindentation; pile-up effect; grain size; dislocation motion; grain boundary activities

资金

  1. National Natural Science Foundation of China [11727803, 11672356, 51371089]
  2. Innovation team in key areas of Shaanxi Province [2016KCT-30]

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Nanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at an indentation depth of 2000 nm at room temperature. As the grain size increases, the height of the pile-up around the residual indentation increases and then exhibits a slightly decrease in the CG Cu. The maximum of the pile-up in the CG Cu obviously deviates from the center of the indenter sides. Our analysis has revealed that the dislocation motion and GB activities in the NC Cu, some cross- and multiple-slip dislocations inside the larger grain in the UFG Cu, and forest dislocations from the intragranular Frank-Read sources in the CG Cu would directly induce this distinct pile-up effect.

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