3.8 Article

pMOSFETs Featuring ALD W Filling Metal Using SiH4 and B2H6 Precursors in 22 nm Node CMOS Technology

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Article Engineering, Electrical & Electronic

Selective epitaxy growth of Si1-xGex layers for MOSFETs and FinFETs

Henry H. Radamson et al.

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)

Article Engineering, Electrical & Electronic

Integration of highly-strained SiGe materials in 14 nm and beyond nodes FinFET technology

Guilei Wang et al.

SOLID-STATE ELECTRONICS (2015)

Article Materials Science, Multidisciplinary

Application of Atomic Layer Deposition Tungsten (ALD W) as Gate Filling Metal for 22 nm and Beyond Nodes CMOS Technology

Guilei Wang et al.

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2014)

Proceedings Paper Electrochemistry

ALD W CMP for HKMG

Tao Yang et al.

ULSI PROCESS INTEGRATION 8 (2013)

Review Engineering, Electrical & Electronic

Impact strain engineering on gate stack quality and reliability

C. Claeys et al.

SOLID-STATE ELECTRONICS (2008)

Article Physics, Applied

Impact of gate metal-induced stress on performance modulation in gate-last metal-oxide-semiconductor field-effect transistors

Takeo Matsuki et al.

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2007)

Article Engineering, Electrical & Electronic

Selective epitaxial Si/SiGe growth for V-T shift adjustment in high k pMOS devices

R. Loo et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2007)

Article Electrochemistry

A comparative study of the atomic-layer-deposited tungsten thin films as nucleation layers for W-plug deposition

Soo-Hyun Kim et al.

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2006)

Article Physics, Condensed Matter

Application of high-resolution x-ray diffraction for detecting defects in SiGe(C) materials

HH Radamson et al.

JOURNAL OF PHYSICS-CONDENSED MATTER (2005)

Article Engineering, Electrical & Electronic

Comparison of threshold-voltage shifts for uniaxial and biaxial tensile-stressed n-MOSFETs

JS Lim et al.

IEEE ELECTRON DEVICE LETTERS (2004)

Article Materials Science, Multidisciplinary

Atomic layer deposition of tungsten using sequential surface chemistry with a sacrificial stripping reaction

JW Klaus et al.

THIN SOLID FILMS (2000)