期刊
ACTA MATERIALIA
卷 123, 期 -, 页码 285-294出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2016.10.038
关键词
High-entropy alloy; Fibers; Tensile strength and ductility; Cryogenic behavior; Nano-twinning
资金
- National High Technology Research and Development Program of China [2009AA03Z113]
- National Science Foundation of China [51210105006, 51471025]
- U.S. Army Research Office [W911NF-13-1-0438]
- National Science Foundation [DMR-1611180]
- [DE-FE-0011194]
- Division Of Materials Research
- Direct For Mathematical & Physical Scien [1611180] Funding Source: National Science Foundation
High-entropy alloys (HEAs) are multi-component systems based on novel alloy composition designs with entropy maximization. They feature an array of unique mechanical properties when compared with traditional alloys. In this study, HEA fibers with diameters ranging from 1 to 3.15 mm in diameter, with the composition of Al0.3CoCrFeNi (atomic percent, at.%), were successfully fabricated by hot-drawing, followed by microstructural characterization using scanning-electron microscopy (SEM) and transmission-electron microscopy (TEM). The compositional variations within and between fibers were determined using energy-dispersive X-ray spectroscopy in TEM along with atomic-probe tomography (APT). These analyses revealed a homogeneous face-centered cubic (FCC) structure in the as-cast material, while post processing (e.g., forging and wire drawing) produced nanosized B2 particles in an FCC matrix. Electron back-scatter diffraction (EBSD) was used to determine the evolution of the texture and grain boundary character after processing of the fibers. The tensile strength and plasticity of the fibers were determined at both 298 K (1207 MPa/7.8%) and 77 K (1600 MPa/17.5%). Detailed TEM analyses revealed that the improvement of mechanical properties at 77 K (i.e. increased strength and ductility) is due to a change in deformation mechanisms from the planar slip of dislocations to nano-twinning. Such properties could be beneficial for cryogenic applications. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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