期刊
APPLIED PHYSICS LETTERS
卷 110, 期 14, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.4979477
关键词
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资金
- Intel Corporation
- National Science Foundation [CBET-12-36373]
- NSF Research Triangle MRSEC [DMR-11-21107]
- NSF Graduate Research Fellowship [DGF-11-06401]
Hotspot cooling is critical to the performance and reliability of electronic devices, but existing techniques are not very effective in managing mobile hotspots. We report a hotspot cooling technique based on a jumping-drop vapor chamber consisting of parallel plates of a superhydrophilic evaporator and a superhydrophobic condenser, where the working fluid is returned via the spontaneous out-of-plane jumping of condensate drops. While retaining the passive nature of traditional vapor-chamber heat spreaders (flat-plate heat pipes), the jumping-drop technique offers a mechanism to address mobile hotspots with a pathway toward effective thermal transport in the out-of-plane direction. Published by AIP Publishing.
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