4.6 Article

Hotspot cooling with jumping-drop vapor chambers

期刊

APPLIED PHYSICS LETTERS
卷 110, 期 14, 页码 -

出版社

AMER INST PHYSICS
DOI: 10.1063/1.4979477

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资金

  1. Intel Corporation
  2. National Science Foundation [CBET-12-36373]
  3. NSF Research Triangle MRSEC [DMR-11-21107]
  4. NSF Graduate Research Fellowship [DGF-11-06401]

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Hotspot cooling is critical to the performance and reliability of electronic devices, but existing techniques are not very effective in managing mobile hotspots. We report a hotspot cooling technique based on a jumping-drop vapor chamber consisting of parallel plates of a superhydrophilic evaporator and a superhydrophobic condenser, where the working fluid is returned via the spontaneous out-of-plane jumping of condensate drops. While retaining the passive nature of traditional vapor-chamber heat spreaders (flat-plate heat pipes), the jumping-drop technique offers a mechanism to address mobile hotspots with a pathway toward effective thermal transport in the out-of-plane direction. Published by AIP Publishing.

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