4.8 Article

Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles

期刊

MATERIALS TODAY PHYSICS
卷 1, 期 -, 页码 31-38

出版社

ELSEVIER
DOI: 10.1016/j.mtphys.2017.05.004

关键词

Silicon carbide; Thermal conductivity; Phonon-phonon interaction; Electron-phonon interaction; Density functional theory; Boltzmann transport equation

资金

  1. Office of Naval Research MURI [N00014-16-1-2436]
  2. Pleiades computational cluster of Boston College
  3. National Science Foundation [ACI-1548562]
  4. U.S. Department of Energy, Office of Science, Office of Basic Energy Sciences, Materials Sciences and Engineering Division
  5. Air Force Office of Scientific Research, USAF [FA9550615-1-0187 DEF]

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Silicon carbide (SiC) is a wide band gap semiconductor with a variety of industrial applications. Among its many useful properties is its high thermal conductivity, which makes it advantageous for thermal management applications. In this paper we present ab initio calculations of the in-plane and cross-plane thermal conductivities, kin and kout, of three common hexagonal polytypes of SiC: 2H, 4H and 6H. The phonon Boltzmann transport equation is solved iteratively using as input interatomic force constants determined from density functional theory. Both kin and kout decrease with increasing n in nH SiC because of additional low-lying optic phonon branches. These optic branches are characterized by low phonon group velocities, and they increase the phase space for phonon-phonon scattering of acoustic modes. Also, for all n, kin is found to be larger than kout in the temperature range considered. At electron concentrations present in experimental samples, scattering of phonons by electrons is shown to be negligible except well below room temperature where it can lead to a significant reduction of the lattice thermal conductivity. This work highlights the power of ab initio approaches in giving quantitative, predictive descriptions of thermal transport in materials. It helps explain the qualitative disagreement that exists among different sets of measured thermal conductivity data and provides information of the relative quality of samples from which measured data was obtained. (c) 2017 Elsevier Ltd. All rights reserved.

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