Chitosan-assisted buffer layer incorporated with hydroxypropyl methylcellulose-coated silver nanowires for paper-based sensors

Fabricating flexible sensors on paper is intriguing. Here, we exploited chitosan as a buffer layer to facilitate the fabrication of silver nanowire (AgNW) networks and flexible devices on commercial paper. We found that the AgNW networks exhibited uniform distribution, smooth surface, and strong adhesion. The enhanced adhesion of AgNWs was attributed to the intermolecular hydrogen bonding between chitosan and hydroxypropyl methylcellulose (HPMC), which can be tailored by tuning the pH of the chitosan aqueous solution. This facile fabrication method utilizing biodegradable polymers and cost-effective AgNW ink holds great promise for portable, wearable, and disposable paper-based electronics. (C) 2017 The Japan Society of Applied Physics