4.8 Article

One-Step Device Fabrication of Phosphorene and Graphene Interdigital Micro-dSupercapacitors with High Energy Density

期刊

ACS NANO
卷 11, 期 7, 页码 7284-7292

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsnano.7b03288

关键词

phosphorene; graphene; micro-supercapacitors; ionic liquid; energy storage

资金

  1. National Natural Science Foundation of China [51572259, 51325205, 51290273, 51521091]
  2. National Key RAMP
  3. D Program of China [2016YBF0100100, 2016YFA0200101, 2016YFA0200200]
  4. Natural Science Foundation of Liaoning Province [201602737]
  5. Thousand Youth Talents Plan of China, DICP [Y5610121T3]
  6. China Postdoctoral Science Foundation [2016M601348]

向作者/读者索取更多资源

Rational engineering and simplified fabrication of high-energy micro-supercapacitors (MSCs) using graphene and other 2D nanosheets are of great value for flexible and integrated electronics. Here we develop onestep mask-assisted simplified fabrication of high-energy MSCs (PG-MSCs) based on the interdigital hybrid electrode (PG) patterns of stacking high-quality phosphorene nanosheets and electrochemically exfoliated graphene in ionic liquid electrolyte. The hybrid PG films with interdigital patterns were directly manufactured by layer-by layer deposition of phosphorene and graphene nanosheets with the assistance of a customized interdigital mask, and directly transferred onto a flexible substrate. The resultant patterned PG films present outstanding uniformity, flexibility, conductivity (319 S cm(-1)), and structural integration, which can directly serve as binder- and additive-free flexible electrodes for MSCs. Remarkably, PG-MSCs deliver remarkable energy density of 11.6 mWh cm(-3), outperforming most nanocarbon-based MSCs. Moreover, our PG-MSCs show outstanding flexibility and stable performance with slight capacitance fluctuation even under highly folded states. In addition, our simplified mask-assisted strategy for PG-MSCs is highly flexible for simplified production of parallelly and serially interconnected modular power sources, without need of conventional metal-based interconnects and contacts, for designable integrated circuits with high output current and voltage.

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