4.8 Article

Nanostructural Tailoring to Induce Flexibility in Thermoelectric Ca3Co4O9 Thin Films

期刊

ACS APPLIED MATERIALS & INTERFACES
卷 9, 期 30, 页码 25308-25316

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsami.7b06301

关键词

Ca3Co4O9; thermoelectrics; nanostructure; flexible film; transferable film

资金

  1. European Research Council (ERC) under the European Community [335383]
  2. Swedish Research Council (VR) [2012-4430]
  3. Eurostars project T-to-Power [E!8892]
  4. Swedish Foundation for Strategic Research (SSF) through the Future Research Leaders 5 program
  5. European Research Council (ERC) [335383] Funding Source: European Research Council (ERC)

向作者/读者索取更多资源

Because of their inherent rigidity and brittleness, inorganic materials have seen limited use in flexible thermoelectric applications. On the other hand, for high output power density and stability, the use of inorganic materials is required. Here, we demonstrate a concept of fully inorganic flexible thermoelectric thin films with Ca3Co4O9-on-mica. Ca3Co4O9 is promising not only because of its high Seebeck coefficient and good electrical conductivity but also because of the abundance, low cost, and nontoxicity of its constituent raw materials. We show a promising nanostructural tailoring approach to induce flexibility in inorganic thin-film materials, achieving flexibility in nanostructured Ca3Co4O9 thin films. The films were grown by thermally induced phase transformation from CaO-CoO thin films deposited by reactive rf-magnetron cosputtering from metallic targets of Ca and Co to the final phase of Ca3Co4O9 on a mica substrate. The pattern of nanostructural evolution during the solid-state phase transformation is determined by the surface energy and strain energy contributions, whereas different distributions of CaO and CoO phases in the as-deposited films promote different nanostructuring during the phase transformation. Another interesting fact is that the Ca3Co4O9 film is transferable onto an arbitrary flexible platform from the parent mica substrate by etch-free dry transfer. The highest thermoelectric power factor obtained is above 1 x 10(-4) W m(-1) K-2 in a wide temperature range, thus showing low-temperature applicability of this class of materials.

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