期刊
ADVANCED FUNCTIONAL MATERIALS
卷 27, 期 36, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.201701912
关键词
core-shell vias; double-side integration; rigid islands; stretchable hybrid electronics; universal platforms
类别
资金
- Institute for Information & communications Technology Promotion (IITP) grant - Korea government (MSIP) [2017-0-00048]
- Institute for Information & Communication Technology Planning & Evaluation (IITP), Republic of Korea [2017-0-00048-001] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Soft features in electronic devices have provided an opportunity of gleaning a wide spectrum of intimate biosignals. Lack of data processing tools in a soft form, however, proclaims the need of bulky wires or low-performance near-field communication externally linked to a rigid processor board, thus tarnishing the true meaning of soft electronics. Furthermore, although of rising interest in stretchable hybrid electronics, lack of consideration in multilayer, miniaturized design and system-level data computing limits their practical use. The results presented here form the basis of fully printable, system-level soft electronics for practical data processing and computing with advanced capabilities of universal circuit design and multilayer device integration into a single platform. Single droplet printing-based integration of rigid islands and core-shell vertical interconnect access (via) into a common soft matrix with a symmetric arrangement leads to a double-side universal soft electronic platform that features site-selective, simultaneous double-side strain isolation, and vertical interconnection, respectively. Systematic studies of island-morphology engineering, surface-strain mapping, and electrical analysis of the platform propose optimized designs. Commensurate with the universal layout, a complete example of double-side integrated, stretchable 1 MHz binary decoders comprised of 36 logic gates interacting with 9 vias is demonstrated by printing-based, double-side electronic functionalization.
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