4.8 Article

Hybrid 3D Printing of Soft Electronics

期刊

ADVANCED MATERIALS
卷 29, 期 40, 页码 -

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201703817

关键词

conductive elastomers; multimaterial 3D printing; pick-and-place; soft sensors

资金

  1. Air Force Research Laboratory, Materials and Manufacturing Directorate
  2. UES, Inc. [S-875-040-017]
  3. Vannevar Bush Faculty Fellowship Program - Basic Research Office of the Assistant Secretary of Defense for Research and Engineering
  4. Office of Naval Research [N00014-16-1-2823]

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Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices.

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