期刊
CHEMICAL ENGINEERING JOURNAL
卷 328, 期 -, 页码 585-590出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2017.07.092
关键词
Metastable intermolecular composite; Core-shell structure; Energy-release characteristics; Al/CuO
资金
- Fundamental Research Funds for the Central Universities [30916011315]
- National Natural Science Foundation of China [51676082]
- Priority Academic Program Development of Jiangsu Higher Education Institutions
- Qing Lan Project
Nanostructured energetic composites, in which the oxidizing component and the reducing component are uniformly distributed and intimately contacted, are attracting much attention in recent years. In this study, a new method is developed to facilely prepare CuO nanotubes and accordingly the core-shell structured Al/CuO metastable intermolecular composite (MIC) thin film on a silicon substrate. Cr and Cu thin films are sputter-deposited onto the silicon substrate sequentially, where Cr thin film functions as the adhesion layer. The silicon substrate is then immersed in a mixture of NaOH and (NH4)(2)S2O8 to form one-dimensional Cu(OH)(2) nanostructures, which are then dehydrated at 180 degrees C to form CuO nanotubes. Nano Al is then sputter-deposited around CuO to obtain core-shell Al/CuO MIC. The morphological, structural and compositional information of the core-shell Al/CuO MIC is characterized by field emission scanning electron microscopy, transmission electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy. The energy-release characteristics of core-shell Al/CuO MIC are studied by differential scanning calorimetry and differential thermal analysis, and the preliminary laser ignition test is conducted by using pulsed Nd: YAG laser. The results show that the prepared Al/CuO MIC possesses a fine core-shell structure and is highly exothermic. The preparation method developed is suitable for the facile synthesis of non-cracking core-shell Al/CuO MIC thin film that can be integrated with microelectromechanical systems to realize functional energetic chips. (C) 2017 Elsevier B.V. All rights reserved.
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