Electroless deposition of CoBW coatings using morpholine borane as a reducing agent

Electroless cobalt-tungsten-boron (CoWB) coatings have been obtained on the copper surface from glycine containing solutions, using morpholine borane as a reducing agent. The effects of concentration of the reactants, solution pH and temperature on the deposition rate were investigated. The morphology and composition of CoBW coatings were characterized by means of Field-Emission Scanning Electron Microscopy and X-ray Photoelectron Spectroscopy. It has been determined, that the rate of electroless deposition of the CoBW coatings and their composition depends on the concentration of disodium tungstate and reducing agent, as well as on pH and temperature of the plating solution. Electroless deposition of the CoBW coatings can be performed in a wide temperature range from 30 to 70 degrees C. Changing conditions of the electroless deposition of CoBW the coatings containing 5.5 to 16 at.% of boron and 5 to 14 at.% of tungsten can be obtained. (C) 2017 Elsevier B.V. All rights reserved.