期刊
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
卷 -, 期 -, 页码 1328-1333出版社
IEEE
DOI: 10.1109/ECTC.2017.244
关键词
molding compound; high temperature; epoxy; cyanate ester
资金
- Georgia Tech Packaging Research Center
As the number of electronic components in automobiles increases, the electronic industry has seen an increasing demand for organic packaging materials that meet property requirements for long operations in harsh environments. One of the most challenging requirements for molding compounds for automotive electronics is high thermal stability. The plastic encapsulation material should survive continuous operations beyond 150 degrees C. Epoxy-based molding compounds (EMCs) are widely used encapsulant in electronic packages for their high performance and low cost. However, EMCs generally fail high-temperature operation tests and new encapsulant materials should be developed. In this report, epoxy/cyanate ester copolymers are prepared and their curing, thermomechanical, and thermal aging properties are evaluated.
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