期刊
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)
卷 -, 期 -, 页码 2269-2274出版社
IEEE
DOI: 10.1109/ECTC.2017.151
关键词
3D glass package; thermal modeling; mechanical modeling; camera packaging
This paper describes advances in glass substrates for automotive cameras. Typical camera sensors are housed in ceramic packaging and are displaced from related processing components whereas glass substrates allow integration of image sensing and processing components yielding higher data rates while not sacrificing signal strength. Proper design of the glass substrate using thermal vias and coefficient of thermal expansion matching can negate distortion caused by thermal expansion.
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