相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。A review of micro-devices assembly techniques and technology
J. Cecil et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2016)
Sliding droplets on hydrophilic/superhydrophobic patterned surfaces for liquid deposition
Bo Chang et al.
APPLIED PHYSICS LETTERS (2016)
The springtail cuticle as a blueprint for omniphobic surfaces
Rene Hensel et al.
CHEMICAL SOCIETY REVIEWS (2016)
Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration
Yuka Ito et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2016)
Maskless, High-Precision, Persistent, and Extreme Wetting-Contrast Patterning in an Environmental Scanning Electron Microscope
Ville Liimatainen et al.
SMALL (2016)
Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips
Vikas Dubey et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016)
Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries
Shantonu Biswas et al.
MICROMACHINES (2016)
Capillary Self-Alignment of Microchips on Soft Substrates
Bo Chang et al.
MICROMACHINES (2016)
Technologies That Enable Accurate and Precise Nano- to Milliliter-Scale Liquid Dispensing of Aqueous Reagents Using Acoustic Droplet Ejection
Eric K. Sackmann et al.
JALA (2016)
The Fluid Joint: The Soft Spot of Micro- and Nanosystems
Massimo Mastrangeli
ADVANCED MATERIALS (2015)
Stability of Constrained Capillary Surfaces
J. B. Bostwick et al.
ANNUAL REVIEW OF FLUID MECHANICS, VOL 47 (2015)
Advances in Colloidal Assembly: The Design of Structure and Hierarchy in Two and Three Dimensions
Nicolas Vogel et al.
CHEMICAL REVIEWS (2015)
Capillary Gripping and Self-Alignment: A Route Toward Autonomous Heterogeneous Assembly
G. Arutinov et al.
IEEE TRANSACTIONS ON ROBOTICS (2015)
Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications
Se-Chul Park et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2015)
Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning
Gari Arutinov et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2015)
Optimization and evaluation of the size-free integration process for MEMS-IC assembly with high yields and high efficiency
Jian Lu et al.
MICROELECTRONIC ENGINEERING (2015)
Stabilization of the tilt motion during capillary self-alignment of rectangular chips
J. Berthier et al.
SENSORS AND ACTUATORS A-PHYSICAL (2015)
Self-transport and self-alignment of microchips using microscopic rain
Bo Chang et al.
SCIENTIFIC REPORTS (2015)
Modeling capillary forces for large displacements
Massimo Mastrangeli et al.
MICROFLUIDICS AND NANOFLUIDICS (2015)
A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine
Se-Chul Park et al.
ADVANCED MATERIALS (2014)
Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film
Takafumi Fukushima et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2014)
Surface Tension-Driven Self-Alignment of Microchips on Low-Precision Receptors
Iiris Routa et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2014)
In-Plane Mode Dynamics of Capillary Self-Alignment
Gari Arutinov et al.
LANGMUIR (2014)
Dip-Coating Deposition on Chemically Patterned Surfaces: A Mechanistic Analysis and Comparison with Topographically Patterned Surfaces
Yan Wang et al.
LANGMUIR (2014)
Turning a surface superrepellent even to completely wetting liquids
Tingyi Leo Liu et al.
SCIENCE (2014)
Low-height sharp edged patterns for capillary self-alignment assisted hybrid microassembly
Bo Chang et al.
JOURNAL OF MICRO-BIO ROBOTICS (2014)
Controlling Liquid Spreading Using Microfabricated Undercut Edges
Ville Liimatainen et al.
ADVANCED MATERIALS (2013)
Moving Contact Lines: Scales, Regimes, and Dynamical Transitions
Jacco H. Snoeijer et al.
ANNUAL REVIEW OF FLUID MECHANICS, VOL 45 (2013)
Dynamics of capillary self-alignment for mesoscopic foil devices
Gari Arutinov et al.
APPLIED PHYSICS LETTERS (2013)
Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils
Emine Eda Kuran et al.
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING (2013)
Optimization of Angular Alignment in Self-Assembly of Thin Parts at an Air-Water Interface
Kwang Soon Park et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2013)
Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force
Jean Berthier et al.
MICROFLUIDICS AND NANOFLUIDICS (2013)
Laser-assisted ultrathin die packaging: Insights from a process study
Val R. Marinov et al.
MICROELECTRONIC ENGINEERING (2013)
Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis
ShiQing Gao et al.
MICROELECTRONICS RELIABILITY (2013)
Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments
Jens L. M. Taprogge et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2013)
Surface-tension driven self-assembly of microchips on hydrophobic receptor sites with water using forced wetting
Bo Chang et al.
APPLIED PHYSICS LETTERS (2012)
Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation
Takafumi Fukushima et al.
IEEE TRANSACTIONS ON ELECTRON DEVICES (2012)
Self-Assembly and Self-Tiling: Integrating Active Dies Across Length Scales on Flexible Substrates
Robert J. Knuesel et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2012)
Capillary self-alignment of mesoscopic foil components for sensor-systems-in-foil
Gari Arutinov et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2012)
Droplet Compression and Relaxation by a Superhydrophobic Surface: Contact Angle Hysteresis
Siang-Jie Hong et al.
LANGMUIR (2012)
Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates
Val Marinov et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2012)
Capillary-driven self-assembly of microchips on oleophilic/oleophobic patterned surface using adhesive droplet in ambient air
Bo Chang et al.
APPLIED PHYSICS LETTERS (2011)
Dip-coating of chemically patterned surfaces
B. J. Brasjen et al.
CHEMICAL ENGINEERING AND PROCESSING-PROCESS INTENSIFICATION (2011)
Self-alignment in the stacking of microchips with mist-induced water droplets
Bo Chang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2011)
Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly
Bo Chang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2011)
Mechanics and scaling of thin part assembly at a fluidic interface
Kwang Soon Park et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2011)
Nanoscale Origami for 3D Optics
Jeong-Hyun Cho et al.
SMALL (2011)
Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly
Ming Kong et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing
Takafumi Fukushima et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Challenges for Capillary Self-Assembly of Microsystems
Massimo Mastrangeli et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2011)
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Takafumi Fukushima et al.
MICROMACHINES (2011)
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
T. Fukushima et al.
APPLIED PHYSICS LETTERS (2010)
Hybrid Microassembly Combining Robotics and Water Droplet Self-Alignment
Veikko Sariola et al.
IEEE TRANSACTIONS ON ROBOTICS (2010)
Self-alignment of silicon chips on wafers: A capillary approach
J. Berthier et al.
JOURNAL OF APPLIED PHYSICS (2010)
Wafer-Level Transfer Technologies for PZT-Based RF MEMS Switches
Roland Guerre et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2010)
Fluidic assembly of hybrid MEMS: a GaAs-based microcantilever spin injector
Steve Arscott et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2010)
Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study
M. Mastrangeli et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2010)
Spectral analysis and experimental study of lateral capillary dynamics for flip-chip applications
P. Lambert et al.
MICROFLUIDICS AND NANOFLUIDICS (2010)
Self-assembly of microscopic chiplets at a liquid-liquid-solid interface forming a flexible segmented monocrystalline solar cell
Robert J. Knuesel et al.
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA (2010)
Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly
M. Mastrangeli et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2009)
Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques
Y. A. Chapuis et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2009)
Self-assembly from milli-to nanoscales: methods and applications
M. Mastrangeli et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2009)
Wetting and spreading
Daniel Bonn et al.
REVIEWS OF MODERN PHYSICS (2009)
Selective transfer technology for microdevice distribution
Roland Guerre et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2008)
Comparison between two capillary forces models
Pierre Lambert et al.
LANGMUIR (2008)
Hybrid microhandling: a unified view of robotic handling and self-assembly
Veikko Sariola et al.
JOURNAL OF MICRO-BIO ROBOTICS (2008)
Micro-scale metal contacts for capillary force-driven self-assembly
Christopher J. Morris et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2008)
Self-alignment of microchips using surface tension and solid edge
C. Gary Tsai et al.
SENSORS AND ACTUATORS A-PHYSICAL (2007)
Physical properties of ionic liquids: Database and evaluation
Suojiang Zhang et al.
JOURNAL OF PHYSICAL AND CHEMICAL REFERENCE DATA (2006)
Application of capillary forces and stiction for lateral displacement, alignment, suspension and locking of self-assembled microcantilevers
F. Rose et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2006)
Self-assembled single-crystal silicon circuits on plastic
Sean A. Stauth et al.
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA (2006)
Fluidic heterogeneous microsystems assembly and packaging
Wei Zheng et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2006)
Wafer-level packaging based on uniquely orienting self-assembly (The DUO-SPASS processes)
Jiandong Fang et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2006)
Self-assembly for microscale and nanoscale packaging: Steps toward self-packaging
CJ Morris et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2005)
Dynamic analysis of flip-chip self-alignment
H Lu et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2005)
Resin self-alignment processes for self-assembly systems
JM Kim et al.
JOURNAL OF ELECTRONIC PACKAGING (2005)
A study of capillary forces as a gripping principle
P Lambert et al.
ASSEMBLY AUTOMATION (2005)
High-performance inductors using capillary based fluidic self-assembly
KL Scott et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2004)
Dynamic modeling for resin self-alignment mechanism
JM Kim et al.
MICROELECTRONICS RELIABILITY (2004)
Surface tension-powered self-assembly of micro structures - The state-of-the-art
RRA Syms et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2003)
Controlled multibatch self-assembly of microdevices
XR Xiong et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2003)
Self-alignment of microparts using liquid surface tension - behavior of micropart and alignment characteristics
K Sato et al.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2003)
Fluidic self-assembly of micromirrors onto microactuators using capillary forces
U Srinivasan et al.
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS (2002)
Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps
JI Sasaki et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2001)
Microstructure to substrate self-assembly using capillary forces
U Srinivasan et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2001)
Selective dip-coating of chemically micropatterned surfaces
AA Darhuber et al.
JOURNAL OF APPLIED PHYSICS (2000)