Assessment of the High Field Behaviour of Polyimide Films: Experimental Methods and Impact of Electrode Material

The assessment of the dielectric behavior of thin Polyimide films submitted to high DC stress is investigated considering different characterization methods. Materials of interest are polyimide films of 11 to 16 mu m in thickness deposited by spin coating on a silicon wafer. Comparison is made with structures with a thin SiO2 layer onto the substrate. The laser intensity modulation method appears suited to probe space charges in the films investigated therein. These measurements show that the presence of a SiO2 layer strongly limits the electrons injection.