期刊
CIRP ANNALS-MANUFACTURING TECHNOLOGY
卷 66, 期 1, 页码 535-538出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.cirp.2017.04.071
关键词
Glass; Laser micro machining; Femtosecond laser pulses
资金
- National Research Foundation of the Republic of Korea [NRF-2012R1A3A1050386]
Chemically strengthened glass used for smartphones and tablets is cut into elaborate shapes by creating internal cracks using femtosecond laser pulses. The peak power is set at near ionization intensities of similar to 10(14) W/cm(2) to initiate sub-surface cracks by strong nonlinear absorption underneath the stress-compressed glass surface at a 560 mu m depth. Then sub-surface cracks are laterally guided with a feed-rate of 5-40 minis to realize accurate cutting along tensile-residual-stress lines formed around the material-modified zone inside the glass substrate. The cutting plane maintains a mirror-like cross-section profile without excessive flaws and thermal damage usually seen in conventional laser ablation. (C) 2017 Published by Elsevier Ltd on behalf of CIRP.
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