期刊
CRYSTAL GROWTH & DESIGN
卷 18, 期 1, 页码 52-56出版社
AMER CHEMICAL SOC
DOI: 10.1021/acs.cgd.7b01502
关键词
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资金
- Council of Scientific and Industrial Research, India [01(2908)/17/EMR-II]
- UGC
- RGNF
Crystal structures and thermal expansion properties have been studied for hexamethylbenzene (HMB), picric acid (PIC), tetracyanobenzene (TCB), HMB-PIC complex, and HMB-TCB complex. HMB-PIC and HMB-TCB form charge transfer complexes in the solid state as well as in solution. From the UV-vis spectroscopy study, it has been found that HMB-TCB forms a stronger complex than HMB-PIC. On the other hand, HMB, in its crystal structure, forms a very weak pi center dot center dot center dot pi stacking interaction. A thermal expansion study shows that thermal expansion along the stacking direction is highest in HMB, which is followed by HMB-PIC and then by HMB-TCB complexes. Therefore, this study shows that stronger pi center dot center dot center dot pi stacking interaction leads to a weaker thermal expansion in the materials.
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