期刊
PROGRESS IN QUANTUM ELECTRONICS
卷 52, 期 -, 页码 1-17出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.pquantelec.2017.01.001
关键词
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资金
- Science Foundation Ireland [12/RC/2276 (IPIC)]
- European Union's Horizon Research and Innovation Programme [645314 (TOP-HIT)]
- US National Science Foundation
- Army Research Office
- Mr Force Office of Scientific Research
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [GRANTS:13815733] Funding Source: National Science Foundation
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [1308520] Funding Source: National Science Foundation
The essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. Additionally, new device configurations can be achieved that could not otherwise be realised. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. This is leading to exciting possibilities in microassembly. We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates.
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