期刊
ADVANCED COMPOSITES AND HYBRID MATERIALS
卷 1, 期 2, 页码 207-230出版社
SPRINGERNATURE
DOI: 10.1007/s42114-018-0031-8
关键词
Thermally conductive polymeric composites; Measurement methods; Model and equations; Mechanism
资金
- Foundation of National Natural Science Foundation of China [51773169, 51403175]
- Open Fund from State Key Laboratory of Solid Lubrication of Lanzhou Institute of Chemical Physics [LSL-1715]
- Fundamental Research Funds for the Central Universities [3102017jg02003]
- State Key Laboratory of Solidification Processing in NPU [SKLSP201713]
- American Chemical Society Petroleum Research Fund [55570-DNI10]
- NSF [CBET-1603264]
With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the lambda value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.
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