期刊
PLANT GROWTH REGULATION
卷 83, 期 2, 页码 313-323出版社
SPRINGER
DOI: 10.1007/s10725-017-0296-x
关键词
Oryza sativa L.; Heat stress; Pollen mother cell meiosis stage; Salicylic acid; Spikelet degeneration
资金
- National Natural Science Foundation of China [31501264, 31561143003]
- China National Rice Research Institute [2014RG004-4]
- Special Fund for Agro-Scientific Research in The Public Interest [201203029]
- National System of Rice Industry [CARS-01-27]
- National Food Science and Technology Project [2016 YFD 0300208]
Salicylic acid (SA) can alleviate damage to rice plants induced by heat stress, but its role in preventing spikelet degeneration under high-temperature stress has not been documented. Rice plants pretreated with SA (0-50 mmol L-1) were subjected to heat stress at 40 A degrees C at the pollen mother cell meiosis stage for 10 days. The results indicated that there were no significant differences in grain yields and yield components among rice plants that were exogenously sprayed with SA (0-50 mmol L-1) under natural conditions. Under heat stress, the grain yield, spikelet number per panicle and setting rate in response to SA treatments were higher than under the control (0 mmol L-1 SA or NON-SA) treatment, especially with 1 and 10 mmol L-1 SA. A higher grain yield, spikelet number per panicle and setting rate were recorded in these two SA treatments compared with the NON-SA treatment. During this process, soluble sugars, proline, phytohormones including ABA, GA(3), BRs, IAA, ZR and JA, and antioxidant enzymes, such as superoxide dismutase, peroxidase (POD), catalase (CAT) and ascorbate peroxidase (APX), were induced by SA. Moreover, soluble sugars, IAA, POD and APX in the spikelets with SA treatments were not only higher than with the NON-SA treatment but the changing patterns were also similar to that of the spikelet number per panicle under natural conditions and heat stress. Therefore, our results suggest that sugars, antioxidant enzymes and IAA might mediate SA to prevent spikelet degeneration caused by heat stress.
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