期刊
ENGINEERING FRACTURE MECHANICS
卷 138, 期 -, 页码 127-145出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.engfracmech.2015.02.020
关键词
Crack growth; Finite-elements-methods (FEM) simulations; MOSFET; Power cycling; Chip-metallization; Thermomechanics
类别
This paper studies the failure mechanisms occurring in the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. Simulations of electronic packages is really advantageous: power cycling tests are time consuming and ageing parameters difficult to monitor, whereas simulations allow a detailed study of stresses, plastic strain and even crack growth. A numerical sensitivity study, previously unseen, gives us important information about the influence of test parameters on the mechanical behavior of chip-metallization. (C) 2015 Elsevier Ltd. All rights reserved.
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