Flexible integrated OLED substrates prepared by printing and plating process

We developed a cost- effective process to fabricate a flexible integrated organic light- emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels. (C) 2017 Elsevier B.V. All rights reserved.