期刊
OPTICS AND LASER TECHNOLOGY
卷 88, 期 -, 页码 128-133出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.optlastec.2016.09.021
关键词
Cu complex ink; Selective laser sintering; Patterning; Metallization
资金
- National Research Foundation of Korea (NRF) - Korea government (MSIP) [2015R1A2A1A15053000]
- National Research Foundation of Korea [2015R1A2A1A15053000] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be removed from the film by rinsing it with the dispersing agent used to synthesize the ink, disclosing a conductive Cu pattern. A minimum resistivity of 8.46x10(-5) Omega cm was obtained for the Cu lines with 10-20 mu m widths. The feasibility of this method for metallization was demonstrated by fabricating a complex Cu electric circuit on an indium tin oxide-coated glass substrate. The selective laser sintering approach provides a simple, cost-effective alternative to conventional lithography for the production of electrode or metallization patterns.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据