期刊
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
卷 -, 期 -, 页码 306-308出版社
IEEE
关键词
Electroless Deposition; Catalyst; Metal-Organic Frameworks; PdCu/C
资金
- National Key R&D Project from Minister of Science and Technology of China [2017YFB0406200]
- Guangzhou industrial-academic-research cooperation program [201508010031]
- Guangdong province industrial-academic-research cooperation program [2014B090901017]
- Leading Scientific Research Project of Chinese Academy of Sciences [QYZDY-SSW-JSC010]
- Nation-Shenzhen Joint Engineering Laboratory (Shenzhen Development and Reform Committee) [2017-934]
- Guangdong Provincial Key Laboratory [2014B030301014]
Herein, carbon supported PdCu alloy is synthesized using copper-based metal-organic frameworks (MOFs) as both precursor and sacrificial template. The PdCu alloy nanoparticles with diameter around 60 nm were evenly distributed on the MOFs derived carbon matrix. The as prepared PdCu/C hybrid exhibits impressive catalytic performance for electroless copper deposition on three different substrates, i.e., epoxy board, polyethylene terephthalate film and tissue paper. Our work suggests that alloying Cu with Pd on carbon matrix is an efficient way to provide cheap and stable catalyst for printed conductive circuit.
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