期刊
ELECTRONICS LETTERS
卷 51, 期 20, 页码 1561-1562出版社
INST ENGINEERING TECHNOLOGY-IET
DOI: 10.1049/el.2015.2186
关键词
electrical products industry; dipole antennas; microstrip antennas; frequency 2; 6 GHz; AMC ground plane; balun; wavelength printed dipole; three-dimensional conducting networks; robust antenna system; conductive microdispensing printing; integrated artificial magnetic conducting ground plane; embedded low-profile antennas; multimaterial additive manufacturing
资金
- U.S. Navy's Office of Naval Research
A low-profile antenna that includes an integrated artificial magnetic conducting (AMC) ground plane is presented and is fully fabricated using multi-material additive manufacturing. It is shown that combining standard fused deposition modelling with conductive micro-dispensing printing enable one to realise mechanically robust antenna systems that contain spatially variable dielectric properties and intricate three-dimensional conducting networks. To illustrate this capability, a low-profile antenna is designed, fabricated, and experimentally validated, consisting of a standard 2.6 GHz half wavelength printed dipole, balun, and AMC ground plane.
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